For investors
A thermal layer that becomes mandatory as density rises.
Every generation adds watts per square millimetre. The enclosure, the cooler and the interface do not keep up, so thermal derating becomes the limit on usable performance, and the fix closest to the die wins. Xtherma sits at that point: a layer that removes the bottleneck where it forms, drops into existing packages, and locks in once qualified.
at the junction at the highest load tested. The gain grew as the load rose, and the rest of the cooling chain was shown to be untouched.
Junction temperature rise above room
Kelvin, steady state, same hardware, same cooler
Independent, on real hardware
An OEM measured the layer on its own production module and found the junction 11 °C cooler with the rest of the chain untouched.
Qualification is the moat
Once embedded in a qualified module, replacement means re-qualification. OEMs design the next product around the headroom the layer unlocks.
Protected architecture
Patent applications filed covering the substrate structure, its manufacturing route and the integration path into packages.
Disciplined wedge
High-value, thermally constrained modules first: customer-funded evaluations, then qualification, then recurring supply. Evaluation programmes are running with industrial OEMs and research institutes in Europe.
What the brief contains
- The material basis, the manufacturing route and the cost trajectory.
- Full third-party test reports and raw data behind the figures on this page.
- Customer pipeline, evaluation status, IP portfolio and the financing plan.
The investor brief
Sent personally by the founder, under a short mutual NDA, with a call to walk through the data.